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PD IEC/TS 62878-2-4:2015
Device embedded substrate Guidelines. Test element groups (TEG)
Device embedded substrate Guidelines. Test element groups (TEG)
Vydáno: 2015-04-30
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BS CECC 265001:1998
Harmonized system of quality assessment for electronic components. Technology approval schedule. Film and hybrid integrated circuits
Harmonized system of quality assessment for electronic components. Technology approval schedule. Film and hybrid integrated circuits
Vydáno: 1999-07-15
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BS 123500-003:2001
System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections
System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections
Vydáno: 2001-12-17
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199.75 €
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279.17 €
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368.22 €
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BS 123800-003:2001
System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections
System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections
Vydáno: 2001-12-17
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BS EN 61188-1-2:1998
Printed boards and assemblies. Design and use. Generic requirements Generic requirements. Controlled impedance
Printed boards and assemblies. Design and use. Generic requirements Generic requirements. Controlled impedance
Vydáno: 1998-12-15
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BS 123600:2001
System of quality assessment. Sectional specification. Flex-rigid multilayer printed boards with through-connections
System of quality assessment. Sectional specification. Flex-rigid multilayer printed boards with through-connections
Vydáno: 2001-12-17
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199.75 €
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279.17 €
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279.17 €