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>BSI Standards>31 ELEKTRONIKA>31.180 Plošné spoje a desky s plošnými spoji

31.180 Plošné spoje a desky s plošnými spoji

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258 results
First page123...151618202122Last page
BS EN 61249-5-1:1996
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings Copper foils (for the manufacture of copper-clad base materials)
Vydáno: 1996-09-15
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PD IEC/TS 62878-2-4:2015
Device embedded substrate Guidelines. Test element groups (TEG)
Vydáno: 2015-04-30
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BS EN 61189-11:2013
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Measurement of melting temperature or melting temperature ranges of solder alloys
Vydáno: 2013-07-31
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BS 123300:2001
System of quality assessment. Sectional specification. Rigid multilayer printed boards
Vydáno: 2001-12-17
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PD IEC/TR 63018:2015
Flexible printed circuit boards (FPCBs). Method to decrease signal loss by using noise suppression materials
Vydáno: 2015-12-16
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BS 123800-003:2001
System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections
Vydáno: 2001-12-17
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BS EN 61188-1-2:1998
Printed boards and assemblies. Design and use. Generic requirements Generic requirements. Controlled impedance
Vydáno: 1998-12-15
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DD IEC/PAS 61249-3-1:2007
Materials for printed boards and other interconnecting structures Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
Vydáno: 2007-10-31
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BS EN IEC 61188-6-4:2019
Printed boards and printed board assemblies. Design and use Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
Vydáno: 2019-07-12
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BS EN IEC 61189-5-503:2017
Test methods for electrical materials, printed board and other interconnection structures and assemblies General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards
Vydáno: 2018-04-13
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BS 4584-103.2:1990
Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for copper foil for use in the manufacture of copper-clad base materials
Vydáno: 1990-02-28
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BS EN 61188-1-1:1997
Printed boards and assemblies. Design and use. Generic requirements Flatness considerations for electronic assemblies
Vydáno: 1997-12-15
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258 results
First page123...151618202122Last page