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Main page>BSI Standards>31 ELEKTRONIKA>31.180 Plošné spoje a desky s plošnými spoji

31.180 Plošné spoje a desky s plošnými spoji

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258 results
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BS EN 61249-2-12:1999
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Epoxide non-woven aramid laminate of defined flammability, copper-clad
Vydáno: 1999-06-15
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BS EN 61249-2-5:2003
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Vydáno: 2006-07-31
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BS 123200-003:2001
System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes
Vydáno: 2001-12-17
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BS 123200:2001
System of quality assessment. Sectional specification. Rigid double-sided printed boards with plated-through holes
Vydáno: 2001-12-17
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BS 123000:2001
System of quality assessment. Generic specification. Printed boards
Vydáno: 2001-12-17
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BS EN 61076-4-114:2003
Connectors for electronic equipment. Printed board connectors with assessed quality Detail specification for two-part connector with integrated shielding function having a grid of 1 mm x 1,5 mm
Vydáno: 2003-06-23
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BS 123300-003:2001
System of quality assessment. Capability detail specification. Rigid multilayer printed boards
Vydáno: 2001-12-17
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BS EN 61249-2-37:2009
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Vydáno: 2009-04-30
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BS EN 61188-1-1:1997
Printed boards and assemblies. Design and use. Generic requirements Flatness considerations for electronic assemblies
Vydáno: 1997-12-15
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BS EN 61193-1:2002
Quality assessment systems Registration and analysis of defects on printed board assemblies
Vydáno: 2002-05-14
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PD IEC/TS 62878-2-4:2015
Device embedded substrate Guidelines. Test element groups (TEG)
Vydáno: 2015-04-30
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BS EN IEC 61189-5-601:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
Vydáno: 2021-03-19
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258 results
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