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PD IEC/TS 62878-2-1:2015
Device embedded substrate Guidelines. General description of technology
Device embedded substrate Guidelines. General description of technology
Vydáno: 2015-04-30
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BS EN 61191-3:2017 - TC
Tracked Changes. Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
Tracked Changes. Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
Vydáno: 2020-02-26
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BS 123300-003:2001
System of quality assessment. Capability detail specification. Rigid multilayer printed boards
System of quality assessment. Capability detail specification. Rigid multilayer printed boards
Vydáno: 2001-12-17
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BS EN 62496-1:2009
Optical circuit boards General
Optical circuit boards General
Vydáno: 2009-07-31
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BS EN 62496-3-1:2010
Optical circuit boards. Performance standard Flexible optical circuit boards using unconnectorized optical glass fibres
Optical circuit boards. Performance standard Flexible optical circuit boards using unconnectorized optical glass fibres
Vydáno: 2010-06-30
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BS EN 61249-8-7:1997
Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Marking legend inks
Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Marking legend inks
Vydáno: 1997-03-15
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BS EN 62496-4:2011
Optical circuit boards Interface standards. General and guidance
Optical circuit boards Interface standards. General and guidance
Vydáno: 2011-03-31
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