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Homepage>BSI Standards>31 ELEKTRONIKA>31.180 Plošné spoje a desky s plošnými spoji

31.180 Plošné spoje a desky s plošnými spoji

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256 results
First page123...6810...202122Last page
BS EN 61249-2-39:2013
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Vydáno: 2013-04-30
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BS EN IEC 61189-5-601:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
Vydáno: 2021-03-19
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BS EN 61249-2-37:2009
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Vydáno: 2009-04-30
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BS EN 61193-1:2002
Quality assessment systems Registration and analysis of defects on printed board assemblies
Vydáno: 2002-05-14
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PD IEC/TS 62878-2-4:2015
Device embedded substrate Guidelines. Test element groups (TEG)
Vydáno: 2015-04-30
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BS CECC 265001:1998
Harmonized system of quality assessment for electronic components. Technology approval schedule. Film and hybrid integrated circuits
Vydáno: 1999-07-15
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BS 123500-003:2001
System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections
Vydáno: 2001-12-17
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BS EN 61188-1-2:1998
Printed boards and assemblies. Design and use. Generic requirements Generic requirements. Controlled impedance
Vydáno: 1998-12-15
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DD IEC/PAS 61249-3-1:2007
Materials for printed boards and other interconnecting structures Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
Vydáno: 2007-10-31
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BS EN 61189-11:2013
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Measurement of melting temperature or melting temperature ranges of solder alloys
Vydáno: 2013-07-31
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BS 123800-003:2001
System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections
Vydáno: 2001-12-17
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BS 123600:2001
System of quality assessment. Sectional specification. Flex-rigid multilayer printed boards with through-connections
Vydáno: 2001-12-17
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256 results
First page123...6810...202122Last page