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PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Vydáno: 2022-08-23
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BS EN IEC 63251:2023
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
Vydáno: 2023-12-19
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386.51 €
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412.59 €
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24/30477141 DC
BS ISO 13060 An adhesion evaluation method for microcircuits on PCB (Printed Circuit Board) by scratch test
BS ISO 13060 An adhesion evaluation method for microcircuits on PCB (Printed Circuit Board) by scratch test
Vydáno: 2024-08-09
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25/30507775 DC
BS IEC 62899-202-14 Printed electronics Part 202-14: Materials - Test methods of conductive ink suitability for screen printing
BS IEC 62899-202-14 Printed electronics Part 202-14: Materials - Test methods of conductive ink suitability for screen printing
Vydáno: 2024-12-20
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PD IEC TR 62899-250:2025 - TC
Tracked Changes. Printed electronics Material technologies required in printed electronics for wearable smart devices
Tracked Changes. Printed electronics Material technologies required in printed electronics for wearable smart devices
Vydáno: 2025-03-25
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BS IEC 62899-401:2025
Printed electronics Printability. Overview
Printed electronics Printability. Overview
Vydáno: 2025-05-13
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