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IPC-7092 - Revision A
Design and Assembly Process Implementation for Embedded Circuitry
Design and Assembly Process Implementation for Embedded Circuitry
Published date: 01.10.2022
English Secure PDF
Immediate download
Non-printable
169.63 €
English Hardcopy
10-14 dní
254.44 €
Japanese Secure PDF
Immediate download
Non-printable
237.31 €
Japanese Hardcopy
10-14 dní
355.97 €
IPC-7095 - Revision C
Design and Assembly Process Implementation for BGAs
Design and Assembly Process Implementation for BGAs
Published date: 28.01.2013
Chinese Secure PDF
Immediate download
Non-printable
169.63 €
Chinese Hardcopy
10-14 dní
254.44 €
English Secure PDF
Immediate download
Non-printable
169.63 €
English Hardcopy
10-14 dní
254.44 €
IPC-J-STD-028 - Standard Only
Performance Standard for Construction of Flip Chip and Chip Scale Bumps
Performance Standard for Construction of Flip Chip and Chip Scale Bumps
Published date: 01.08.1999
English Secure PDF
Immediate download
Non-printable
132.79 €
English Hardcopy
10-14 dní
199.19 €
IPC-7093 - Revision B
Design and Assembly Process Implementation for Bottom Termination Components (BTCs)
Design and Assembly Process Implementation for Bottom Termination Components (BTCs)
Published date: 01.02.2026
English Secure PDF
Immediate download
Non-printable
169.63 €
English Hardcopy
10-14 dní
254.44 €
IPC-7091 - Revision A
Design and Assembly Process Implementation of 3D Components
Design and Assembly Process Implementation of 3D Components
Published date: 01.01.2023
English Secure PDF
Immediate download
Non-printable
169.63 €
English Hardcopy
10-14 dní
254.44 €
IPC-7092 - Standard Only
Design and Assembly Process Implementation for Embedded Components
Design and Assembly Process Implementation for Embedded Components
Published date: 18.02.2015
Chinese Secure PDF
Immediate download
Non-printable
169.63 €
Chinese Hardcopy
10-14 dní
254.44 €
English Secure PDF
Immediate download
Non-printable
169.63 €
English Hardcopy
10-14 dní
254.44 €
IPC-7093 - Revision A
Design and Assembly Process Implementation for Bottom Termination Components (BTCs)
Design and Assembly Process Implementation for Bottom Termination Components (BTCs)
Published date: 01.10.2020
Chinese Secure PDF
Immediate download
Non-printable
169.63 €
Chinese Hardcopy
10-14 dní
254.44 €
English Secure PDF
Immediate download
Non-printable
169.63 €
English Hardcopy
10-14 dní
254.44 €
Japanese Secure PDF
Immediate download
Non-printable
237.31 €
Japanese Hardcopy
10-14 dní
355.97 €
IPC-7094 - Standard Only
Design and Assembly Process Implementation for Flip Chip and Die Size Components
Design and Assembly Process Implementation for Flip Chip and Die Size Components
Published date: 18.03.2009
English Secure PDF
Immediate download
Non-printable
169.63 €
English Hardcopy
10-14 dní
254.44 €
IPC-7095 - Revision B
Design and Assembly Process Implementation for BGAs
Design and Assembly Process Implementation for BGAs
Published date: 02.04.2008
English Secure PDF
Immediate download
Non-printable
169.63 €
English Hardcopy
10-14 dní
254.44 €
IPC-J-STD-026 - Standard Only
Semiconductor Design Standard for Flip Chip Applications
Semiconductor Design Standard for Flip Chip Applications
Published date: 01.08.1999
English Secure PDF
Immediate download
Non-printable
132.79 €
English Hardcopy
10-14 dní
199.19 €
IPC-7091 - Standard Only
Design and Assembly Process Implementation of 3D Components
Design and Assembly Process Implementation of 3D Components
Published date: 02.06.2017
English Secure PDF
Immediate download
Non-printable
169.63 €
English Hardcopy
10-14 dní
254.44 €
IPC-7093 - Standard Only
Design and Assembly Process Implementation for Bottom Termination Components
Design and Assembly Process Implementation for Bottom Termination Components
Published date: 28.03.2011
Chinese Secure PDF
Immediate download
Non-printable
169.63 €
Chinese Hardcopy
10-14 dní
254.44 €
English Secure PDF
Immediate download
Non-printable
169.63 €
English Hardcopy
10-14 dní
254.44 €