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IPC-J-STD-003 - Revision B
Solderability Tests for Printed Boards
Solderability Tests for Printed Boards
Published date: 01.03.2007
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173.74 €
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10-14 dní
260.61 €
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173.74 €
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260.61 €
IPC-J-STD-004 - Revision A
Requirements for Soldering Fluxes
Requirements for Soldering Fluxes
Published date: 01.01.2004
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173.74 €
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260.61 €
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173.74 €
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260.61 €
IPC-J-STD-020 - Revision E
Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
Published date: 03.02.2015
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97.40 €
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146.10 €
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97.40 €
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10-14 dní
146.10 €
Japanese Secure PDF
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136.01 €
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10-14 dní
204.01 €
Spanish Secure PDF
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97.40 €
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10-14 dní
146.10 €
IPC-J-STD-027 - Standard Only
Mechanical Outline Standard for Flip Chip and Chip Size Configurations
Mechanical Outline Standard for Flip Chip and Chip Size Configurations
Published date: 01.02.2003
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97.40 €
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IPC-J-STD-028 - Standard Only
Performance Standard for Construction of Flip Chip and Chip Scale Bumps
Performance Standard for Construction of Flip Chip and Chip Scale Bumps
Published date: 01.08.1999
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136.01 €
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IPC-J-STD-030 - Revision A
Selection and Application of Board Level Underfill Materials
Selection and Application of Board Level Underfill Materials
Published date: 24.03.2014
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173.74 €
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IPC-J-STD-048 - Standard Only
Notification Standard for Product Discontinuance
Notification Standard for Product Discontinuance
Published date: 02.05.2015
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97.40 €
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IPC-J-STD-075 - Revision A
Classification of Passive and Solid State Devices for Assembly Processes
Classification of Passive and Solid State Devices for Assembly Processes
Published date: 01.11.2022
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99.15 €
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148.73 €
IPC-J-STD-609 - Revision B
Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes
Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes
Published date: 01.10.2016
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97.40 €
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IPC-PE-740 - Revision A
Troubleshooting for Printed Board Manufacture and Assembly
Troubleshooting for Printed Board Manufacture and Assembly
Published date: 01.12.1997
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IPC-T-50 - Revision J
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Published date: 18.10.2011
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173.74 €
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IPC-TP-1114 - Standard Only
The Layman's Guide to Qualifying a Process to J-STD-001
The Layman's Guide to Qualifying a Process to J-STD-001
Published date: 01.01.1998
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81.60 €
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122.41 €