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>BS EN IEC 62878-2-603:2025 Device embedding assembly technology Guideline for stacked electronic module. Test method of intra-module electrical connectivity
sklademVydáno: 2025-04-16
BS EN IEC 62878-2-603:2025 Device embedding assembly technology Guideline for stacked electronic module. Test method of intra-module electrical connectivity

BS EN IEC 62878-2-603:2025

Device embedding assembly technology Guideline for stacked electronic module. Test method of intra-module electrical connectivity

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Označení normy:BS EN IEC 62878-2-603:2025
Počet stran:18
Vydáno:2025-04-16
ISBN:978 0 539 17596 7
Status:Standard
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BS EN IEC 62878-2-603:2025


This standard BS EN IEC 62878-2-603:2025 Device embedding assembly technology is classified in these ICS categories:
  • 31.180 Printed circuits and boards
  • 31.190 Electronic component assemblies
IEC 62878-2-603:2025 specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules. This method is realized to make use of bidirectional serial communication bus interface applied to the stackable electronic modules which are assured as "known good module" (KGM).
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