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>BS IEC 63011-1:2018 Integrated circuits. Three dimensional integrated circuits Terminology
sklademVydáno: 2019-01-24
BS IEC 63011-1:2018 Integrated circuits. Three dimensional integrated circuits Terminology

BS IEC 63011-1:2018

Integrated circuits. Three dimensional integrated circuits Terminology

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Označení normy:BS IEC 63011-1:2018
Počet stran:16
Vydáno:2019-01-24
ISBN:978 0 580 96278 3
Status:Standard
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BS IEC 63011-1:2018


This standard BS IEC 63011-1:2018 Integrated circuits. Three dimensional integrated circuits is classified in these ICS categories:
  • 31.200 Integrated circuits. Microelectronics
IEC 63011-1:2018 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided.
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