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BS 3934-5:1997
Mechanical standardization of semiconductor devices Recommendations applying to tape automated bonding (TAB) of integrated circuits
Mechanical standardization of semiconductor devices Recommendations applying to tape automated bonding (TAB) of integrated circuits
Vydáno: 1997-09-15
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BS 7241:1989
Specification for IEC 822 VSB: parallel sub-system bus of the IEC 821 VME bus
Specification for IEC 822 VSB: parallel sub-system bus of the IEC 821 VME bus
Vydáno: 1990-03-30
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454.07 €
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252.53 €
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BS EN 60068-2-13:1999
Environmental testing. Test methods Tests. Test M. Low air pressure
Environmental testing. Test methods Tests. Test M. Low air pressure
Vydáno: 1999-09-15
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BS EN 60068-2-77:1999
Environmental testing. Test methods Body strength and impact shock
Environmental testing. Test methods Body strength and impact shock
Vydáno: 1999-09-15
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BS EN 60191-3:2000
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of integrated circuits
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of integrated circuits
Vydáno: 2000-06-15
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352.08 €
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296.24 €
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182.11 €
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252.53 €
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BS EN 60191-6-16:2007
Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Vydáno: 2007-07-31
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252.53 €
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