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Homepage>BSI Standards>31 ELEKTRONIKA>31.080 Polovodičové součástky>31.080.01 Polovodičové součástky obecně

31.080.01 Polovodičové součástky obecně

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170 results
First page123...579...131415Last page
18/30375624 DC
BS EN 60749-20-1. Semiconductor devices. Mechanical and climatic test methods Part 20-1. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
Vydáno: 2018-07-13
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BS EN IEC 60749-26:2018 - TC
Tracked Changes. Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Human body model (HBM)
Vydáno: 2020-02-27
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BS IEC 62779-4:2020
Semiconductor devices. Semiconductor interface for human body communication Capsule endoscope
Vydáno: 2020-07-17
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BS IEC 60747-14-11:2021
Semiconductor devices Semiconductor sensors. Test method of surface acoustic wave-based integrated sensors for measuring ultraviolet, illumination and temperature
Vydáno: 2021-03-12
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BS EN 60191-6-20:2010
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)
Vydáno: 2010-12-31
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BS IEC 62951-5:2019
Semiconductor devices. Flexible and stretchable semiconductor devices Test method for thermal characteristics of flexible materials
Vydáno: 2019-03-05
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BS EN 60191-6-8:2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for glass sealed ceramic quad flatpack (G-QFP)
Vydáno: 2001-11-16
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PD ES 59008-5-1:2001
Data requirements for semiconductor die. Particular requirements and recommendations for die types Bare die
Vydáno: 2001-07-15
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PD ES 59008-4-1:2001
Data requirements for semiconductor die. Specific requirements and recommendations Test and quality
Vydáno: 2001-03-15
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BS IEC 62047-29:2017
Semiconductor devices. Micro-electromechanical devices Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
Vydáno: 2018-03-15
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BS EN 60191-6-16:2007
Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Vydáno: 2007-07-31
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PD ES 59008-6-2:2001
Data requirements for semiconductor die. Exchange data formats and data dictionary Data dictionary
Vydáno: 2001-06-15
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170 results
First page123...579...131415Last page