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BS EN IEC 60747-16-6:2019
Semiconductor devices Microwave integrated circuits. Frequency multipliers
Semiconductor devices Microwave integrated circuits. Frequency multipliers
Vydáno: 2019-09-02
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BS EN 62298-3:2005
Teleweb application Superteletext profile
Teleweb application Superteletext profile
Vydáno: 2005-10-14
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BS IEC 60747-18-2:2020
Semiconductor devices Semiconductor bio sensors. Evaluation process of lens-free CMOS photonic array sensor package modules
Semiconductor devices Semiconductor bio sensors. Evaluation process of lens-free CMOS photonic array sensor package modules
Vydáno: 2020-02-21
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BS EN 60749-35:2006
Semiconductor devices. Mechanical and climatic test methods Acoustic microscopy for plastic encapsulated electronic components
Semiconductor devices. Mechanical and climatic test methods Acoustic microscopy for plastic encapsulated electronic components
Vydáno: 2006-11-30
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BS EN 60749-22:2003
Semiconductor devices. Mechanical and climatic test methods Bond strength
Semiconductor devices. Mechanical and climatic test methods Bond strength
Vydáno: 2003-07-04
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BS IEC 60747-16-2:2001
Semiconductor devices Microwave integrated circuits. Frequency prescalers
Semiconductor devices Microwave integrated circuits. Frequency prescalers
Vydáno: 2008-01-31
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BS EN 60749-31:2003
Semiconductor devices. Mechanical and climatic test methods Flammability of plastic-encapsulated devices (internally induced)
Semiconductor devices. Mechanical and climatic test methods Flammability of plastic-encapsulated devices (internally induced)
Vydáno: 2003-07-04
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BS EN 60749-16:2003
Semiconductor devices. Mechanical and climatic test methods Particle impact noise detection (PIND)
Semiconductor devices. Mechanical and climatic test methods Particle impact noise detection (PIND)
Vydáno: 2004-06-24
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BS EN 62418:2010
Semiconductor devices. Metallization stress void test
Semiconductor devices. Metallization stress void test
Vydáno: 2010-08-31
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BS IEC 62483:2013
Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices
Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices
Vydáno: 2013-10-31
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BS IEC 62615:2010
Electrostatic discharge sensitivity testing. Transmission line pulse (TLP). Component level
Electrostatic discharge sensitivity testing. Transmission line pulse (TLP). Component level
Vydáno: 2011-07-31
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