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BS EN 60749-27:2006+A1:2012
Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Machine model (MM)
Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Machine model (MM)
Vydáno: 2013-01-31
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BS EN 62779-1:2016
Semiconductor devices. Semiconductor interface for human body communication General requirements
Semiconductor devices. Semiconductor interface for human body communication General requirements
Vydáno: 2016-06-30
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BS 3934-5:1997
Mechanical standardization of semiconductor devices Recommendations applying to tape automated bonding (TAB) of integrated circuits
Mechanical standardization of semiconductor devices Recommendations applying to tape automated bonding (TAB) of integrated circuits
Vydáno: 1997-09-15
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BS EN 60749-14:2003
Semiconductor devices. Mechanical and climatic test methods Robustness of terminations (lead integrity)
Semiconductor devices. Mechanical and climatic test methods Robustness of terminations (lead integrity)
Vydáno: 2003-12-15
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BS EN 60749-33:2004
Semiconductor devices. Mechanical and climatic test methods Accelerated moisture resistance. Unbiased autoclave
Semiconductor devices. Mechanical and climatic test methods Accelerated moisture resistance. Unbiased autoclave
Vydáno: 2004-06-22
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BS EN 60749-19:2003+A1:2010
Semiconductor devices. Mechanical and climatic test methods Die shear strength
Semiconductor devices. Mechanical and climatic test methods Die shear strength
Vydáno: 2010-10-31
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BS EN 62779-2:2016
Semiconductor devices. Semiconductor interface for human body communication Characterization of interfacing performances
Semiconductor devices. Semiconductor interface for human body communication Characterization of interfacing performances
Vydáno: 2016-06-30
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PD ES 59008-5-3:2001
Data requirements for semiconductor die. Particular requirements and recommendations for die types Minimally-packaged die
Data requirements for semiconductor die. Particular requirements and recommendations for die types Minimally-packaged die
Vydáno: 2001-12-05
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BS EN IEC 60749-41:2020
Semiconductor devices. Mechanical and climatic test methods Standard reliability testing methods of non-volatile memory devices
Semiconductor devices. Mechanical and climatic test methods Standard reliability testing methods of non-volatile memory devices
Vydáno: 2020-09-09
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BS EN 60749-29:2011
Semiconductor devices. Mechanical and climatic test methods Latch-up test
Semiconductor devices. Mechanical and climatic test methods Latch-up test
Vydáno: 2011-08-31
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