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BS EN IEC 60747-15:2024 - TC
Tracked Changes. Semiconductor devices Discrete devices. Isolated power semiconductor devices
Tracked Changes. Semiconductor devices Discrete devices. Isolated power semiconductor devices
Vydáno: 2024-12-20
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24/30488515 DC
BS EN IEC 62047-50. Semiconductor devices. Micro-electromechanical devices Part 50. MEMS capacitive microphone
BS EN IEC 62047-50. Semiconductor devices. Micro-electromechanical devices Part 50. MEMS capacitive microphone
Vydáno: 2024-03-05
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26/30543279 DC
BS EN IEC 62047-57 Micro-electromechanical systems Part 57: RF MEMS directional coupler
BS EN IEC 62047-57 Micro-electromechanical systems Part 57: RF MEMS directional coupler
Vydáno: 2025-12-26
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26/30544420 DC
BS EN IEC 62047-58 Semiconductor devices - Micro-electromechanical systems Part 58: Test methods for performances of MEMS thermopile devices
BS EN IEC 62047-58 Semiconductor devices - Micro-electromechanical systems Part 58: Test methods for performances of MEMS thermopile devices
Vydáno: 2026-02-20
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BS EN IEC 60747-16-7:2022
Semiconductor devices Microwave integrated circuits. Attenuators
Semiconductor devices Microwave integrated circuits. Attenuators
Vydáno: 2023-05-25
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23/30476409 DC
BS IEC 60947-10. Low-voltage switchgear and controlgear Part 10. Semiconductor Circuit-Breakers
BS IEC 60947-10. Low-voltage switchgear and controlgear Part 10. Semiconductor Circuit-Breakers
Vydáno: 2023-07-05
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23/30479765 DC
BS IEC 63512. Test method for continuous-switching evaluation of gallium nitride power conversion devices
BS IEC 63512. Test method for continuous-switching evaluation of gallium nitride power conversion devices
Vydáno: 2023-09-25
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BS EN IEC 62047-4 Semiconductor devices. Micro-electromechanical devices Part 4. Generic specification for MEMS
BS EN IEC 62047-4 Semiconductor devices. Micro-electromechanical devices Part 4. Generic specification for MEMS
Vydáno: 2023-10-20
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BS EN 62047-9:2011
Semiconductor devices. Micro-electromechanical devices Wafer to wafer bonding strength measurement for MEMS
Semiconductor devices. Micro-electromechanical devices Wafer to wafer bonding strength measurement for MEMS
Vydáno: 2013-01-31
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