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24/30499672 DC
BS EN IEC 63550-2 Semiconductor devices - Neuromorphic devices Part 2: Evaluation method of linearity in memristor devices
BS EN IEC 63550-2 Semiconductor devices - Neuromorphic devices Part 2: Evaluation method of linearity in memristor devices
Vydáno: 2024-08-30
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BS EN IEC 63287-2:2023
Semiconductor devices. Guidelines for reliability qualification plans Concept of mission profile
Semiconductor devices. Guidelines for reliability qualification plans Concept of mission profile
Vydáno: 2023-05-23
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BS IEC 62047-44:2024
Semiconductor devices. Micro-electromechanical devices Test methods for dynamic performances of MEMS resonant electric-field-sensitive devices
Semiconductor devices. Micro-electromechanical devices Test methods for dynamic performances of MEMS resonant electric-field-sensitive devices
Vydáno: 2024-02-29
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BS IEC 63602:2026
Guidelines for representing switching losses of SIC MOSFETs in datasheets
Guidelines for representing switching losses of SIC MOSFETs in datasheets
Vydáno: 2026-02-26
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24/30488096 DC
BS EN IEC 62031 LED modules. Safety requirements
BS EN IEC 62031 LED modules. Safety requirements
Vydáno: 2024-04-12
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BS IEC 62047-53:2025
Semiconductor devices. Micro-electromechanical devices MEMS electrothermal transfer device
Semiconductor devices. Micro-electromechanical devices MEMS electrothermal transfer device
Vydáno: 2025-10-08
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BS EN 62047-10:2011
Semiconductor devices. Micro-electromechanical devices Micro-pillar compression test for MEMS materials
Semiconductor devices. Micro-electromechanical devices Micro-pillar compression test for MEMS materials
Vydáno: 2011-09-30
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BS EN 62047-13:2012
Semiconductor devices. Micro-electromechanical devices Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
Semiconductor devices. Micro-electromechanical devices Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
Vydáno: 2012-05-31
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BS IEC 62047-38:2021
Semiconductor devices. Micro-electromechanical devices Test method for adhesion strength of metal powder paste in MEMS interconnection
Semiconductor devices. Micro-electromechanical devices Test method for adhesion strength of metal powder paste in MEMS interconnection
Vydáno: 2021-07-07
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