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24/30499672 DC
BS EN IEC 63550-2 Semiconductor devices - Neuromorphic devices Part 2: Evaluation method of linearity in memristor devices
BS EN IEC 63550-2 Semiconductor devices - Neuromorphic devices Part 2: Evaluation method of linearity in memristor devices
Vydáno: 2024-08-30
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BS EN IEC 60747-16-9:2024
Semiconductor devices Microwave integrated circuits. Phase shifters
Semiconductor devices Microwave integrated circuits. Phase shifters
Vydáno: 2024-11-20
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BS IEC 62047-44:2024
Semiconductor devices. Micro-electromechanical devices Test methods for dynamic performances of MEMS resonant electric-field-sensitive devices
Semiconductor devices. Micro-electromechanical devices Test methods for dynamic performances of MEMS resonant electric-field-sensitive devices
Vydáno: 2024-02-29
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24/30488096 DC
BS EN IEC 62031 LED modules. Safety requirements
BS EN IEC 62031 LED modules. Safety requirements
Vydáno: 2024-04-12
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BS IEC 62951-1:2017
Semiconductor devices. Flexible and stretchable semiconductor devices Bending test method for conductive thin films on flexible substrates
Semiconductor devices. Flexible and stretchable semiconductor devices Bending test method for conductive thin films on flexible substrates
Vydáno: 2018-05-04
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BS EN 62047-10:2011
Semiconductor devices. Micro-electromechanical devices Micro-pillar compression test for MEMS materials
Semiconductor devices. Micro-electromechanical devices Micro-pillar compression test for MEMS materials
Vydáno: 2011-09-30
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BS EN 62047-13:2012
Semiconductor devices. Micro-electromechanical devices Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
Semiconductor devices. Micro-electromechanical devices Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
Vydáno: 2012-05-31
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BS IEC 62047-38:2021
Semiconductor devices. Micro-electromechanical devices Test method for adhesion strength of metal powder paste in MEMS interconnection
Semiconductor devices. Micro-electromechanical devices Test method for adhesion strength of metal powder paste in MEMS interconnection
Vydáno: 2021-07-07
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BS IEC 62047-33:2019
Semiconductor devices. Micro-electromechanical devices MEMS piezoresistive pressure-sensitive device
Semiconductor devices. Micro-electromechanical devices MEMS piezoresistive pressure-sensitive device
Vydáno: 2019-04-18
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