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BS IEC 62047-27:2017
Semiconductor devices. Micro-electromechanical devices Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
Semiconductor devices. Micro-electromechanical devices Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
Vydáno: 2020-07-22
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PD CLC/TR 62258-4:2013
Semiconductor die products Questionnaire for die users and suppliers
Semiconductor die products Questionnaire for die users and suppliers
Vydáno: 2014-11-30
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BS EN 62047-5:2011
Semiconductor devices. Micro-electromechanical devices RF MEMS switches
Semiconductor devices. Micro-electromechanical devices RF MEMS switches
Vydáno: 2013-04-30
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BS IEC 62047-33:2019
Semiconductor devices. Micro-electromechanical devices MEMS piezoresistive pressure-sensitive device
Semiconductor devices. Micro-electromechanical devices MEMS piezoresistive pressure-sensitive device
Vydáno: 2019-04-18
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BS EN 62047-4:2010
Semiconductor devices. Micro-electromechanical devices Generic specification for MEMS
Semiconductor devices. Micro-electromechanical devices Generic specification for MEMS
Vydáno: 2010-11-30
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BS EN 60730-1:1995
Automatic electrical controls for household and similar use General requirements
Automatic electrical controls for household and similar use General requirements
Vydáno: 2004-04-05
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BS EN 62047-8:2011
Semiconductor devices. Micro-electromechanical devices Strip bending test method for tensile property measurement of thin films
Semiconductor devices. Micro-electromechanical devices Strip bending test method for tensile property measurement of thin films
Vydáno: 2011-06-30
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BS EN 61223-3-1:1999
Evaluation and routine testing in medical imaging departments Acceptance tests
Evaluation and routine testing in medical imaging departments Acceptance tests
Vydáno: 1999-08-15
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BS IEC 62047-38:2021
Semiconductor devices. Micro-electromechanical devices Test method for adhesion strength of metal powder paste in MEMS interconnection
Semiconductor devices. Micro-electromechanical devices Test method for adhesion strength of metal powder paste in MEMS interconnection
Vydáno: 2021-07-07
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