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BS EN 62047-10:2011
Semiconductor devices. Micro-electromechanical devices Micro-pillar compression test for MEMS materials
Semiconductor devices. Micro-electromechanical devices Micro-pillar compression test for MEMS materials
Vydáno: 2011-09-30
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BS EN 62047-13:2012
Semiconductor devices. Micro-electromechanical devices Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
Semiconductor devices. Micro-electromechanical devices Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
Vydáno: 2012-05-31
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BS IEC 62951-1:2017
Semiconductor devices. Flexible and stretchable semiconductor devices Bending test method for conductive thin films on flexible substrates
Semiconductor devices. Flexible and stretchable semiconductor devices Bending test method for conductive thin films on flexible substrates
Vydáno: 2018-05-04
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BS IEC 62047-27:2017
Semiconductor devices. Micro-electromechanical devices Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
Semiconductor devices. Micro-electromechanical devices Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
Vydáno: 2020-07-22
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BS EN 62047-8:2011
Semiconductor devices. Micro-electromechanical devices Strip bending test method for tensile property measurement of thin films
Semiconductor devices. Micro-electromechanical devices Strip bending test method for tensile property measurement of thin films
Vydáno: 2011-06-30
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BS EN 61223-3-1:1999
Evaluation and routine testing in medical imaging departments Acceptance tests
Evaluation and routine testing in medical imaging departments Acceptance tests
Vydáno: 1999-08-15
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BS EN 62047-5:2011
Semiconductor devices. Micro-electromechanical devices RF MEMS switches
Semiconductor devices. Micro-electromechanical devices RF MEMS switches
Vydáno: 2013-04-30
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PD CLC/TR 62258-4:2013
Semiconductor die products Questionnaire for die users and suppliers
Semiconductor die products Questionnaire for die users and suppliers
Vydáno: 2014-11-30
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BS IEC 62047-38:2021
Semiconductor devices. Micro-electromechanical devices Test method for adhesion strength of metal powder paste in MEMS interconnection
Semiconductor devices. Micro-electromechanical devices Test method for adhesion strength of metal powder paste in MEMS interconnection
Vydáno: 2021-07-07
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