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19/30357467 DC
BS IEC 62899-201-2. Printed electronics Part 201-2. Materials. Evaluation method of stretchable substrates
BS IEC 62899-201-2. Printed electronics Part 201-2. Materials. Evaluation method of stretchable substrates
Vydáno: 2019-05-13
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DD IEC/PAS 62326-14:2010
Printed boards Device embedded substrate. Terminology / reliability / design guide
Printed boards Device embedded substrate. Terminology / reliability / design guide
Vydáno: 2010-11-30
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BS EN 60191-6-16:2007
Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Vydáno: 2007-07-31
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BS IEC 62899-302-2:2018
Printed electronics Equipment. Inkjet. Imaging-based measurement of droplet volume
Printed electronics Equipment. Inkjet. Imaging-based measurement of droplet volume
Vydáno: 2018-05-18
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BS EN 61249-2-22:2005
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Vydáno: 2005-08-24
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PD IEC/TR 62866:2014
Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
Vydáno: 2014-05-07
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BS IEC 62899-301-2:2017
Printed electronics Equipment. Contact printing. Rigid master. Measurement method of plate master pattern dimension
Printed electronics Equipment. Contact printing. Rigid master. Measurement method of plate master pattern dimension
Vydáno: 2017-11-16
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