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BS IEC 62899-202:2023
Printed electronics Materials. Conductive ink
Printed electronics Materials. Conductive ink
Vydáno: 2023-05-25
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BS IEC 62899-202-10:2023
Printed electronics Materials. Resistance measurement method for thermoformable conducting layer
Printed electronics Materials. Resistance measurement method for thermoformable conducting layer
Vydáno: 2023-08-23
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BS IEC 62899-202-9:2023
Printed electronics Materials. Conductive ink. Printed patterns for mechanical test
Printed electronics Materials. Conductive ink. Printed patterns for mechanical test
Vydáno: 2023-10-26
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PD IEC TS 62878-2-10:2024
Device embedding assembly technology Part 2-10: Design specification for cavity substrate
Device embedding assembly technology Part 2-10: Design specification for cavity substrate
Vydáno: 2024-02-07
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25/30510920 DC
Draft BS EN 62899-202-12 Ed.1.0 Printed electronics : Materials. Rheological property measurement methods of inkjet ink for printed electronics
Draft BS EN 62899-202-12 Ed.1.0 Printed electronics : Materials. Rheological property measurement methods of inkjet ink for printed electronics
Vydáno: 2025-02-25
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BS 123800:2001
System of quality assessment. Sectional specification. Flexible multilayer printed boards with through-connections
System of quality assessment. Sectional specification. Flexible multilayer printed boards with through-connections
Vydáno: 2001-12-17
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BS IEC 62899-204:2019
Printed electronics Materials. Insulator ink. Measurement methods of properties of insulator inks and printed insulating layers
Printed electronics Materials. Insulator ink. Measurement methods of properties of insulator inks and printed insulating layers
Vydáno: 2019-06-07
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BS EN 61249-8-8:1997
Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Temporary polymer coatings
Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Temporary polymer coatings
Vydáno: 1997-12-15
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190.21 €
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