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BS EN 61249-2-22:2005
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Vydáno: 2005-08-24
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PD IEC/TR 62866:2014
Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
Vydáno: 2014-05-07
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PD IEC TR 62878-2-7:2019
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
Vydáno: 2019-04-01
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BS EN 60191-6-16:2007
Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Vydáno: 2007-07-31
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BS EN 123300:1992
Specification for harmonized system of quality assessment for electronic components. Sectional specification. Multilayer printed boards
Specification for harmonized system of quality assessment for electronic components. Sectional specification. Multilayer printed boards
Vydáno: 1989-08-31
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BS IEC 62899-301-2:2017
Printed electronics Equipment. Contact printing. Rigid master. Measurement method of plate master pattern dimension
Printed electronics Equipment. Contact printing. Rigid master. Measurement method of plate master pattern dimension
Vydáno: 2017-11-16
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