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Homepage>BSI Standards>31 ELEKTRONIKA>31.180 Plošné spoje a desky s plošnými spoji

31.180 Plošné spoje a desky s plošnými spoji

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257 results
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BS IEC 62899-202-9:2023
Printed electronics Materials. Conductive ink. Printed patterns for mechanical test
Vydáno: 2023-10-26
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PD IEC TS 62878-2-10:2024
Device embedding assembly technology Part 2-10: Design specification for cavity substrate
Vydáno: 2024-02-07
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BS EN IEC 61189-2-808:2024
Test methods for electrical materials, printed board and other interconnection structures and assemblies Thermal resistance of an assembly by thermal transient method
Vydáno: 2024-06-04
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23/30474274 DC
BS EN IEC 63267-3-81. Fibre optic interconnecting devices and passive components. Connector optical interfaces for enhanced Macro bend multimode fibre Part 3-81. Connector parameters of physically contacting 50 μm core diameter fibres. Non-angled polyphenylene sulphide rectangular ferrules with a single row of 12, 8, 4, or 2 fibres for reference connector applications
Vydáno: 2023-05-26
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BS IEC 62899-202:2023 - TC
Tracked Changes. Printed electronics Materials. Conductive ink
Vydáno: 2023-06-08
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BS IEC 62899-202:2023
Printed electronics Materials. Conductive ink
Vydáno: 2023-05-25
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23/30450091 DC
BS IEC 62899-203-2 Printed electronics Materials - Semiconductor Ink- Space charge limited mobility measurement in printed organic semiconductive layers
Vydáno: 2023-12-01
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BS EN 61189-5-4:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
Vydáno: 2015-04-30
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BS EN 61189-6:2006
Test methods for electrical materials, interconnection structures and assemblies Test methods for materials used in manufacturing electronic assemblies
Vydáno: 2006-09-29
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BS EN 62129-2:2011
Calibration of wavelength/optical frequency measurement instruments Michelson interferometer single wavelength meters
Vydáno: 2011-07-31
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BS EN 61249-2-30:2013
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
Vydáno: 2013-04-30
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PD IEC/TS 61189-3-301:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards). Appearance inspection method for plated surfaces on PWB
Vydáno: 2016-08-31
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257 results
First page123...121416...202122Last page