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BS 123400-003:2001
System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections
System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections
Vydáno: 2001-12-17
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261.96 €
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345.31 €
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BS IEC 62899-202-4:2021
Printed electronics Materials. Conductive ink. Measurement methods for properties of stretchable printed layers (conductive and insulating)
Printed electronics Materials. Conductive ink. Measurement methods for properties of stretchable printed layers (conductive and insulating)
Vydáno: 2021-12-24
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BS EN 61191-3:2017
Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
Vydáno: 2017-09-25
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BS EN 61249-2-23:2005
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Vydáno: 2005-08-25
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BS EN 61249-2-11:2003
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Vydáno: 2006-06-30
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PD IEC/PAS 61182-12:2014
Generic requirements for printed board assembly products manufacturing description data and transfer methodology
Generic requirements for printed board assembly products manufacturing description data and transfer methodology
Vydáno: 2014-10-31
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BS EN IEC 62878-1:2019
Device embedding assembly technology Generic specification for device embedded substrates
Device embedding assembly technology Generic specification for device embedded substrates
Vydáno: 2019-12-17
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