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Homepage>BSI Standards>31 ELEKTRONIKA>31.180 Plošné spoje a desky s plošnými spoji

31.180 Plošné spoje a desky s plošnými spoji

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257 results
First page123...151617192122Last page
BS EN 61188-5-2:2003
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components
Vydáno: 2003-10-16
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BS EN 61188-7:2017
Printed boards and printed board assemblies. Design and use Electronic component zero orientation for CAD library construction
Vydáno: 2017-09-28
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BS 123400:2001
System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards without through-connections
Vydáno: 2001-12-17
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BS EN 61249-2-44:2016
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Vydáno: 2016-07-31
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BS EN 61249-2-11:2003
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Vydáno: 2006-06-30
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BS EN 61188-5-3:2007
Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on two sides
Vydáno: 2007-12-31
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PD IEC/PAS 61182-12:2014
Generic requirements for printed board assembly products manufacturing description data and transfer methodology
Vydáno: 2014-10-31
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BS EN 61189-2-721:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
Vydáno: 2015-06-30
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BS EN 62878-1-1:2015
Device embedded substrate Generic specification. Test methods
Vydáno: 2015-07-31
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BS EN 61249-4-1:2008
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Epoxide woven E-glass prepreg of defined flammability
Vydáno: 2008-07-31
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BS EN IEC 62878-1:2019
Device embedding assembly technology Generic specification for device embedded substrates
Vydáno: 2019-12-17
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BS EN 61189-5-2:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering flux for printed board assemblies
Vydáno: 2015-04-30
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257 results
First page123...151617192122Last page