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BS 123600:2001
System of quality assessment. Sectional specification. Flex-rigid multilayer printed boards with through-connections
System of quality assessment. Sectional specification. Flex-rigid multilayer printed boards with through-connections
Vydáno: 2001-12-17
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BS 123300:2001
System of quality assessment. Sectional specification. Rigid multilayer printed boards
System of quality assessment. Sectional specification. Rigid multilayer printed boards
Vydáno: 2001-12-17
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PD IEC/TS 62878-2-4:2015
Device embedded substrate Guidelines. Test element groups (TEG)
Device embedded substrate Guidelines. Test element groups (TEG)
Vydáno: 2015-04-30
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PD IEC/TR 63018:2015
Flexible printed circuit boards (FPCBs). Method to decrease signal loss by using noise suppression materials
Flexible printed circuit boards (FPCBs). Method to decrease signal loss by using noise suppression materials
Vydáno: 2015-12-16
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PD IEC/TS 62878-2-1:2015
Device embedded substrate Guidelines. General description of technology
Device embedded substrate Guidelines. General description of technology
Vydáno: 2015-04-30
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BS EN IEC 61188-6-1:2021
Circuit boards and circuit board assemblies. Design and use Land pattern design. Generic requirements for land pattern on circuit boards
Circuit boards and circuit board assemblies. Design and use Land pattern design. Generic requirements for land pattern on circuit boards
Vydáno: 2021-04-07
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BS EN 61191-3:2017 - TC
Tracked Changes. Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
Tracked Changes. Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
Vydáno: 2020-02-26
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