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335.40 €
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254.44 €
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BS EN IEC 62878-2-5:2019
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
Vydáno: 2019-11-18
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Anglicky Secure PDF
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Anglicky Secure PDF
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Anglicky Secure PDF
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154.98 €
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154.98 €
Anglicky Secure PDF
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BS 123300-003:2001
System of quality assessment. Capability detail specification. Rigid multilayer printed boards
System of quality assessment. Capability detail specification. Rigid multilayer printed boards
Vydáno: 2001-12-17
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BS EN 62496-1:2009
Optical circuit boards General
Optical circuit boards General
Vydáno: 2009-07-31
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BS EN 61249-2-5:2003
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Vydáno: 2006-07-31
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BS 123200-003:2001
System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes
System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes
Vydáno: 2001-12-17
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BS 123200:2001
System of quality assessment. Sectional specification. Rigid double-sided printed boards with plated-through holes
System of quality assessment. Sectional specification. Rigid double-sided printed boards with plated-through holes
Vydáno: 2001-12-17
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