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>BSI Standards>31 ELEKTRONIKA>31.180 Plošné spoje a desky s plošnými spoji

31.180 Plošné spoje a desky s plošnými spoji

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258 results
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BS CECC 23600-801:1998
Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid multilayer printed boards with through connections
Vydáno: 1998-06-15
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BS IEC 62899-303-1:2018
Printed electronics Equipment. Roll-to-roll printing. Mechanical dimensions
Vydáno: 2018-05-18
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BS EN 61249-2-26:2005
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Vydáno: 2005-10-07
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BS EN 62326-4:1997
Printed boards Rigid multilayer printed boards with interlayer connections. Sectional specification
Vydáno: 1997-06-15
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BS 6221-1:1990
Printed wiring boards Guide for the specification writer
Vydáno: 1990-02-28
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BS EN IEC 61249-2-45:2018
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Vydáno: 2018-04-13
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BS EN IEC 61191-1:2018 - TC
Tracked Changes. Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Vydáno: 2020-02-27
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BS EN 16602-70-60:2019
Space product assurance. Qualification and Procurement of printed circuit boards
Vydáno: 2019-07-19
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PD IEC TR 62899-402-4:2021
Printed electronics Printability. Measurement of qualities. Classification and measurement methods for morphology
Vydáno: 2021-10-29
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BS IEC 62899-402-3:2021
Printed electronics Printability. Measurement of qualities. Voids in printed pattern using a two-dimensional optical image
Vydáno: 2021-04-22
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BS EN IEC 61189-5-301:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering paste using fine solder particles
Vydáno: 2021-05-06
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BS EN IEC 61189-2-801:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Thermal conductivity test for base materials
Vydáno: 2023-12-25
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258 results
First page1245678...202122Last page