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>BSI Standards>31 ELEKTRONIKA>31.180 Plošné spoje a desky s plošnými spoji

31.180 Plošné spoje a desky s plošnými spoji

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256 results
First page123...151617182022Last page
BS 123600:2001
System of quality assessment. Sectional specification. Flex-rigid multilayer printed boards with through-connections
Vydáno: 2001-12-17
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BS EN 61249-5-1:1996
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings Copper foils (for the manufacture of copper-clad base materials)
Vydáno: 1996-09-15
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BS EN IEC 61249-2-46:2018
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Vydáno: 2018-04-16
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BS EN 61189-11:2013
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Measurement of melting temperature or melting temperature ranges of solder alloys
Vydáno: 2013-07-31
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BS 123300:2001
System of quality assessment. Sectional specification. Rigid multilayer printed boards
Vydáno: 2001-12-17
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PD IEC/TR 63018:2015
Flexible printed circuit boards (FPCBs). Method to decrease signal loss by using noise suppression materials
Vydáno: 2015-12-16
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BS EN 61188-1-1:1997
Printed boards and assemblies. Design and use. Generic requirements Flatness considerations for electronic assemblies
Vydáno: 1997-12-15
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BS 4584-103.2:1990
Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for copper foil for use in the manufacture of copper-clad base materials
Vydáno: 1990-02-28
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BS EN 61249-4-18:2013
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Vydáno: 2014-02-28
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BS EN 61249-2-18:2002
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper clad
Vydáno: 2002-05-10
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BS EN IEC 62878-2-5:2019
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
Vydáno: 2019-11-18
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BS EN IEC 61188-6-4:2019
Printed boards and printed board assemblies. Design and use Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
Vydáno: 2019-07-12
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256 results
First page123...151617182022Last page