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BS EN 61191-3:2017 - TC
Tracked Changes. Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
Tracked Changes. Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
Vydáno: 2020-02-26
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BS EN IEC 61188-6-1:2021
Circuit boards and circuit board assemblies. Design and use Land pattern design. Generic requirements for land pattern on circuit boards
Circuit boards and circuit board assemblies. Design and use Land pattern design. Generic requirements for land pattern on circuit boards
Vydáno: 2021-04-07
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BS IEC 62899-202-9:2023
Printed electronics Materials. Conductive ink. Printed patterns for mechanical test
Printed electronics Materials. Conductive ink. Printed patterns for mechanical test
Vydáno: 2023-10-26
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BS IEC 62899-202-10:2023
Printed electronics Materials. Resistance measurement method for thermoformable conducting layer
Printed electronics Materials. Resistance measurement method for thermoformable conducting layer
Vydáno: 2023-08-23
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PD IEC TS 62878-2-10:2024
Device embedding assembly technology Part 2-10: Design specification for cavity substrate
Device embedding assembly technology Part 2-10: Design specification for cavity substrate
Vydáno: 2024-02-07
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