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Homepage>BSI Standards>31 ELEKTRONIKA>31.180 Plošné spoje a desky s plošnými spoji

31.180 Plošné spoje a desky s plošnými spoji

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256 results
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PD IEC TR 62878-2-8:2021
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Vydáno: 2021-07-29
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PD IEC TR 61188-8:2021
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library
Vydáno: 2021-01-22
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BS IEC 62899-202-6:2020
Printed electronics Materials. Conductive ink. Measurement method for resistance changes under high temperature and humidity. Printed conductive layer on a flexible substrate
Vydáno: 2020-12-11
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BS EN IEC 61249-2-47:2018
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Vydáno: 2018-04-18
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PD IEC TR 61191-7:2020
Printed board assemblies Technical cleanliness of components and printed board assemblies
Vydáno: 2020-03-23
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BS EN 62326-4-1:1997
Printed boards. Rigid multilayer printed boards with interlayer connections. Sectional specification Capability detail specification. Performance levels, A, B and C
Vydáno: 1997-06-15
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BS IEC 62899-403-1:2018
Printed electronics Printability. Requirements for reproducibility. Basic patterns for evaluation of printing machine
Vydáno: 2018-06-27
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BS CECC 23700-801:1998
Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid double-sided printed boards with through connections
Vydáno: 1998-06-15
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BS EN 60097:1993
Specification for grid systems for printed circuits
Vydáno: 1993-04-15
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BS EN 61189-2-719:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Relative permittivity and loss tangent (500 MHz to 10 GHz)
Vydáno: 2016-10-31
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BS EN 61249-4-16:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Vydáno: 2009-10-31
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PD IEC/TR 63017:2015
Flexible printed circuit boards (FPCBs). Method of compensation of impedance variations
Vydáno: 2015-12-16
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256 results
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