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BS CECC 200025:1998
Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities
Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities
Vydáno: 1998-08-15
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BS 123700:2001
System of quality assessment. Sectional specification. Flex-rigid double-sided printed boards with through-connections
System of quality assessment. Sectional specification. Flex-rigid double-sided printed boards with through-connections
Vydáno: 2001-12-17
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BS EN 61249-2-6:2003
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Vydáno: 2006-08-31
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BS 123700-003:2001
System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections
System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections
Vydáno: 2001-12-17
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BS EN 61249-5-4:1997
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings Conductive inks
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings Conductive inks
Vydáno: 1997-05-15
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PD IEC TR 61191-8:2021
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Vydáno: 2021-03-25
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PD IEC TR 62878-2-8:2021
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Vydáno: 2021-07-29
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BS EN 60097:1993
Specification for grid systems for printed circuits
Specification for grid systems for printed circuits
Vydáno: 1993-04-15
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