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PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Vydáno: 2022-08-23
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24/30477141 DC
BS ISO 13060 An adhesion evaluation method for microcircuits on PCB (Printed Circuit Board) by scratch test
BS ISO 13060 An adhesion evaluation method for microcircuits on PCB (Printed Circuit Board) by scratch test
Vydáno: 2024-08-09
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PD IEC TR 62899-250:2025 - TC
Tracked Changes. Printed electronics Material technologies required in printed electronics for wearable smart devices
Tracked Changes. Printed electronics Material technologies required in printed electronics for wearable smart devices
Vydáno: 2025-03-25
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25/30507775 DC
BS IEC 62899-202-14 Printed electronics Part 202-14: Materials - Test methods of conductive ink suitability for screen printing
BS IEC 62899-202-14 Printed electronics Part 202-14: Materials - Test methods of conductive ink suitability for screen printing
Vydáno: 2024-12-20
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PD IEC/TS 62878-2-1:2015
Device embedded substrate Guidelines. General description of technology
Device embedded substrate Guidelines. General description of technology
Vydáno: 2015-04-30
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BS EN 61188-1-1:1997
Printed boards and assemblies. Design and use. Generic requirements Flatness considerations for electronic assemblies
Printed boards and assemblies. Design and use. Generic requirements Flatness considerations for electronic assemblies
Vydáno: 1997-12-15
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BS 123200-003:2001
System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes
System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes
Vydáno: 2001-12-17
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