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>BSI Standards>31 ELEKTRONIKA>31.180 Plošné spoje a desky s plošnými spoji

31.180 Plošné spoje a desky s plošnými spoji

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256 results
First page123578...202122Last page
PD IEC TR 62878-2-8:2021
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Vydáno: 2021-07-29
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BS EN 61249-2-41:2010
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Vydáno: 2010-06-30
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BS 123100-003:2001
System of quality assessment. Capability detail specification. Rigid single-sided and double-sided printed boards with plain holes
Vydáno: 2001-12-17
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BS EN 61249-7-1:1996
Materials for interconnection structures. Sectional specification set for restraining core materials Copper/invar/copper
Vydáno: 1996-08-15
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BS EN 61249-2-42:2010
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Vydáno: 2010-06-30
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BS 123100:2001
System of quality assessment. Sectional specification. Rigid single-sided and double-sided printed boards with plain holes
Vydáno: 2001-12-17
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DD IEC/PAS 62326-7-1:2007
Performance guide for single- and double-sided flexible printed wiring boards
Vydáno: 2007-06-29
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BS EN 61249-2-36:2009
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Vydáno: 2009-06-30
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BS CECC 23100-801:1998
Harmonized system of quality assessment for electronic components. Capability detail specification: single and double-sided printed boards with plain holes
Vydáno: 1998-06-15
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BS EN 60079-27:2008
Explosive atmospheres Fieldbus intrinsically safe concept (FISCO)
Vydáno: 2008-07-31
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BS EN IEC 61249-2-47:2018
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Vydáno: 2018-04-18
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PD IEC TR 61191-7:2020
Printed board assemblies Technical cleanliness of components and printed board assemblies
Vydáno: 2020-03-23
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256 results
First page123578...202122Last page