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BS 123600-003:2001
System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections
System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections
Vydáno: 2001-12-17
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BS IEC 62899-403-1:2018
Printed electronics Printability. Requirements for reproducibility. Basic patterns for evaluation of printing machine
Printed electronics Printability. Requirements for reproducibility. Basic patterns for evaluation of printing machine
Vydáno: 2018-06-27
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BS EN 61086-1:2004
Coatings for loaded printed wire boards (conformal coatings) Definitions, classification and general requirements
Coatings for loaded printed wire boards (conformal coatings) Definitions, classification and general requirements
Vydáno: 2004-05-17
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BS 123100-003:2001
System of quality assessment. Capability detail specification. Rigid single-sided and double-sided printed boards with plain holes
System of quality assessment. Capability detail specification. Rigid single-sided and double-sided printed boards with plain holes
Vydáno: 2001-12-17
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BS EN 61249-7-1:1996
Materials for interconnection structures. Sectional specification set for restraining core materials Copper/invar/copper
Materials for interconnection structures. Sectional specification set for restraining core materials Copper/invar/copper
Vydáno: 1996-08-15
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PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Vydáno: 2022-08-23
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