Cena s DPH / bez DPH
sklademVydáno: 2019-10-14
IEC 62878-1:2019
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
Techniques d’assemblage avec appareils intégrés - Partie 1: Spécification générique pour substrats avec appareils intégrés
Formát
Dostupnost
Cena a měna
Anglicky Tisk
skladem
3289 Kč
Anglicky PDF
K okamžitému stažení
3289 Kč
Anglicky/Francouzsky PDF
K okamžitému stažení
3289 Kč
| Označení normy: | IEC 62878-1:2019 |
| Vydáno: | 2019-10-14 |
| Edice: | 1 |
| ICS: | 31.180 |
| Počet stran (Anglicky): | 19 |
| ISBN (Anglicky): | 9782832274606 |
| Počet stran (Anglicky/Francouzsky): | 38 |
| ISBN (Anglicky/Francouzsky): | 9782832279496 |
Popis
IEC 62878-1:2019
IEC 62878-1:2019 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.