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Current revisionPublished date: 11.02.2008
IPC-4563 - Standard Only
Resin Coated Copper Foil for Printed Boards Guideline
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| Standard Number: | IPC-4563 - Standard Only |
| Published date: | 11.02.2008 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Pages (English): | 19 |
Popis
This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies. 19 pages. Released November 2007.