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Published date: 01.05.2001
IPC-7530 - Standard Only
Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
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Chinese Zabezpečené PDF
K okamžitému stažení
Netisknutelné
4124 Kč
Chinese Tisk
10-14 dní
6186 Kč
English Zabezpečené PDF
K okamžitému stažení
Netisknutelné
4124 Kč
English Tisk
10-14 dní
6186 Kč
Hungarian Zabezpečené PDF
K okamžitému stažení
Netisknutelné
3228 Kč
Hungarian Tisk
10-14 dní
4842 Kč
View table of Contents
| Standard Number: | IPC-7530 - Standard Only |
| Published date: | 01.05.2001 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Pages (English): | 118 |
| ISBN (Chinese): | 978-1-61193-270-6 |
| Pages (Chinese): | 18 |
| ISBN (Hungarian): | 978-1-61193-137-2 |
| Pages (Hungarian): | 18 |
Popis
Superseded by IPC-7530 - Revision A
During mass soldering, it is important that all solder joints reach the minimum soldering (reflow) temperature to assure metallurgical bonding of the solder alloy and the base metals to be soldered. Metallurgical bonding requires that both surfaces to be soldered, as well as the solder, reach this minimum soldering temperature for a sufficient time to allow the wetting of the solder surfaces. This document provides guidelines for the construction of appropriate profiling test vehicles and various techniques and methodologies for temperature profiling. 18 pages. Released May 2001.