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Current revisionPublished date: 15.12.2010
IPC-9631 - Standard Only
User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation
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| Standard Number: | IPC-9631 - Standard Only |
| Published date: | 15.12.2010 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| ISBN (English): | 1-580986-79-X |
| Pages (English): | 24 |
Popis
IPC-9631 addresses concerns and considerations related to IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation. This document describes how the test method is intended for use and the rationale behind some of the protocols and requirements. This document was developed with the understanding that the test method will require special equipment and the proper set-up and calibration of that equipment. 11pages. Released December 2010.
Included in the C-1000 Collections.