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Current revisionPublished date: 01.01.2006
IPC-HDBK-005 - Standard Only
Guide to Solder Paste Assessment
Formát
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Chinese Zabezpečené PDF
K okamžitému stažení
Netisknutelné
4124 Kč
Chinese Tisk
10-14 dní
6186 Kč
English Zabezpečené PDF
K okamžitému stažení
Netisknutelné
4124 Kč
English Tisk
10-14 dní
6186 Kč
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| Standard Number: | IPC-HDBK-005 - Standard Only |
| Published date: | 01.01.2006 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Pages (English): | 60 |
| ISBN (Chinese): | 978-1-61193-362-8 |
| Pages (Chinese): | 52 |
Popis
This handbook is a companion to the solder paste standard J-STD-005 and should be considered to be a guide to help assess the applicability of a solder paste for its use in surface mount technology (SMT) processes. This document also suggests some test methods that can help with designing and testing solder pastes. It is intended for use by both vendors and users of solder paste. This document has been written as a guide to assess the applicability of a solder paste for a specific process, given the tremendous number of permutations of different materials, atmospheres and process variables currently available.