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Current revisionPublished date: 01.03.2024
IPC-J-STD-005 - Revision B
Requirements for Solder Pastes
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2312 Kč
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English Zabezpečené PDF
K okamžitému stažení
Netisknutelné
2312 Kč
English Tisk
10-14 dní
3468 Kč
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| Standard Number: | IPC-J-STD-005 - Revision B |
| Published date: | 01.03.2024 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Revision: | B |
| ISBN (English): | 978-1-63816-170-7 |
| Pages (English): | 24 |
| ISBN (Chinese): | 978-1-63816-220-9 |
| Pages (Chinese): | 22 |
Popis
IPC J-STD-005B standard lists the requirements for qualification and characterization of solder paste. It references test methods, criteria, and metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. Additional support is provided in IPC-HDBK-005, Guide to Solder Paste Assessment.