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Current revisionPublished date: 01.11.1990
IPC-SM-784 - Standard Only
Guidelines for Chip-on-Board Technology Implementation
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English Zabezpečené PDF
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| Standard Number: | IPC-SM-784 - Standard Only |
| Published date: | 01.11.1990 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Pages (English): | 53 |
Popis
Discusses chip types, board selection, design issues and thermal transfer methods for Chip on Board (COB) applications. Details wire bonding, TAB and flip chip designs and provides information on mounting materials, including adhesives, wires and various mechanical bonding techniques. 53 pages. Released November 1990.
