Cena s DPH / bez DPH
Current revisionPublished date: 01.07.2001
IPC-TR-486 - Standard Only
Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations
Formát
Dostupnost
Cena a měna
English Zabezpečené PDF
K okamžitému stažení
Netisknutelné
3228 Kč
English Tisk
10-14 dní
4842 Kč
| Standard Number: | IPC-TR-486 - Standard Only |
| Published date: | 01.07.2001 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Pages (English): | 56 |
Popis
This technical report provides full detail of the round robin study charged with assessing the use of Interconnect Stress Test (IST) as a test for incoming inspection in lieu of Thermal Stress in the detection of innerlayer separations in plated-through holes. Includes background on the Post Separation Task Group, test results, round robin test plan, conclusions and test methods used. 56 pages. Released July 2001.