UNE EN IEC 60749-10:2022
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly (Endorsed by Asociación Española de Normalización in July of 2022.)
Dispositivos de semiconductores. Métodos de ensayo mecánicos y climáticos. Parte 10: Choque mecánico. Dispositivo y submontaje. (Ratificada por la Asociación Española de Normalización en julio de 2022.)
| Označení normy: | UNE EN IEC 60749-10:2022 |
| Počet stran: | 20 |
| Vydáno: | 2022-07-01 |
| Status: | Norma |
UNE EN IEC 60749-10:2022
This part of IEC 60749 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test devices in usage conditions as assembled to printed wiring boards. Mechanical shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for device qualification.