UNE EN IEC 63215-2:2023
Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices (Endorsed by Asociación Española de Normalización in January of 2024.)
Métodos de ensayo de resistencia para materiales de fijación de matriz. Parte 2: Método de ensayo de ciclos de temperatura para materiales de fijación de matriz aplicados a dispositivos electrónicos de potencia de tipo discreto (Ratificada por la Asociación Española de Normalización en enero de 2024.)
| Označení normy: | UNE EN IEC 63215-2:2023 |
| Počet stran: | 32 |
| Vydáno: | 2024-01-01 |
| Status: | Norma |
UNE EN IEC 63215-2:2023
This International Standard applies to the die attach materials and joining system applied to discrete type power electronic devices. This International Standard specifies temperature cycling test method which is taking into account of actual usage conditions of discrete type power electronic devices to evaluate reliability of the die attach joint materials and joining system, and establishes classification level for joining reliability (reliability performance index). The test method specified in this standard is not intended to evaluate power semiconductor devices themselves. The test method specified in this standard is not regarded as the one to be used to guarantee the reliability of the power semiconductor device packages.