This document specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) or Sn95,5Ag3Cu0,5 or other lead free solders as agreed between user and supplier (ISO 9453). NOTE This test method is also applicable to fluxes for use with lead containing and lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.