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Hlavní stránka>BS 4393:1991 Specification for solderable tin or tin-lead coated wires for component terminations
sklademVydáno: 1991-04-30
BS 4393:1991 Specification for solderable tin or tin-lead coated wires for component terminations

BS 4393:1991

Specification for solderable tin or tin-lead coated wires for component terminations

Formát
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Cena a měna
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4500 Kč
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Skladem
4500 Kč
Označení normy:BS 4393:1991
Počet stran:20
Vydáno:1991-04-30
ISBN:0 580 19185 0
Status:Standard
Popis

BS 4393:1991


This standard BS 4393:1991 Specification for solderable tin or tin-lead coated wires for component terminations is classified in these ICS categories:
  • 29.060.10 Wires

This British Standard specifies requirements for the solderability, mechanical properties, sampling, packaging and materials of manufacture for tin and tin-lead coated wire. It applies to coated wire which is primarily intended for component leads in the electronics industry, where good solderability is the main criterion, and where the basis wire has a nominal diameter within the range 0.25 mm to 1.20 mm. A range of materials is specified for the basis wire.

Details of information to be supplied by the purchaser are given in appendix A.

The coating thickness range, necessary to achieve good solderability, is specified.

Test methods, particularly for use in cases of dispute, for the measurement of coating thickness, for the determination of the tin content of the coating and for the detection of lead in the coating are given in appendices B, C and D respectively. Appendix E gives the method for carrying out the bend test, which is used for assessing the robustness of the termination and for the coating adhesion.

NOTE 1. Guidance notes to assist the purchaser/user in the selection of the most appropriate basis wire and coating are given in appendix F.

NOTE 2. The titles of the publications referred to in this standard are listed on the inside back cover.


Requirements for solderability, mechanical properties, materials of manufacture, etc., for wires intended for component leads in the electronics industry, where solderability is a major criterion. It deals with wire in a range of materials, in the size range 0.25 mm to 1.20 mm.