ČSN EN IEC 61189-5-601

This part of IEC 61189 specifies the reflow soldering ability test method for components mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid printed boards, and the reflow soldering ability test method for the lands of organic rigid printed boards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or lead-free alloys. The printed boards materials for this organic rigid printed boards are epoxide woven E-glass laminated sheets that are specified in IEC 61249-2 (all parts). The objective of this document is to ensure the soldering ability of the solder joint and of the lands of the printed boards. In addition, test methods are provided to ensure that the printed boards can resist the heat load to which they are exposed during soldering. This document covers tests Tg1, Tg2, Tg3, Tg4, Tg5, and Tg6 listed in Table 1: Table 1 - Test items defined in this document Number of test method Test Method Tg1 Solder joint initial quality after reflow Reflow Tg2 Warpage of component and printed boards in reflow process Tg3 Resistance to soldering heat of printed boards Tg4 Wetting and dewetting of printed board land Tg5 Resistance to dissolution of printed board land Tg6 Pull strength of the test substrate land NOTE - The test methods do not apply to the solder bath method.