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>BSI Standards>31 ELEKTRONIKA>31.080 Polovodičové součástky>31.080.01 Polovodičové součástky obecně

31.080.01 Polovodičové součástky obecně

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178 results
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BS EN 62779-3:2016
Semiconductor devices. Semiconductor interface for human body communication Functional type and its operational conditions
Vydáno: 2016-06-30
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BS EN 60749-36:2003
Semiconductor devices. Mechanical and climatic test methods Acceleration, steady state
Vydáno: 2003-06-19
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BS EN 60749-1:2003
Semiconductor devices. Mechanical and climatic test methods General
Vydáno: 2003-07-07
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BS EN 60191-6-10:2003
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages
Vydáno: 2004-03-31
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BS IEC 62880-1:2017
Semiconductor devices. Stress migration test standard Copper stress migration test standard
Vydáno: 2020-07-21
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BS EN 60191-4:2014+A1:2018
Mechanical standardization of semiconductor devices Coding system and classification into forms of package outlines for semiconductor device packages
Vydáno: 2018-05-30
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BS EN 60191-6-1:2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for gull-wing lead terminals
Vydáno: 2002-03-29
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BS IEC 60747-14-2:2000
Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors Hall elements
Vydáno: 2001-05-15
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BS EN 60191-6-22:2013
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
Vydáno: 2013-04-30
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BS EN 60191-6-18:2010
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)
Vydáno: 2010-10-31
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BS EN 60191-6-5:2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for fine-pitchball grid array (FBGA)
Vydáno: 2001-11-15
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PD IEC TR 63378-1:2021
Thermal standardization on semiconductor packages Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
Vydáno: 2022-01-11
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178 results
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