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BS EN 60191-6-16:2007
Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Vydáno: 2007-07-31
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BS EN 60749-24:2004
Semiconductor devices. Mechanical and climatic test methods Accelerated moisture resistance. Unbiased HAST
Semiconductor devices. Mechanical and climatic test methods Accelerated moisture resistance. Unbiased HAST
Vydáno: 2004-06-24
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BS IEC 63229:2021
Semiconductor devices. Classification of defects in gallium nitride epitaxial film on silicon carbide substrate
Semiconductor devices. Classification of defects in gallium nitride epitaxial film on silicon carbide substrate
Vydáno: 2023-08-31
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BS EN IEC 60749-10:2022
Semiconductor devices. Mechanical and climatic test methods Mechanical shock. device and subassembly
Semiconductor devices. Mechanical and climatic test methods Mechanical shock. device and subassembly
Vydáno: 2022-08-16
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BS IEC 60747-18-4:2023
Semiconductor devices Semiconductor bio sensors. Evaluation method of noise characteristics of lens-free CMOS photonic array sensors
Semiconductor devices Semiconductor bio sensors. Evaluation method of noise characteristics of lens-free CMOS photonic array sensors
Vydáno: 2023-03-27
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24/30497546 DC
BS EN IEC 60749-24 Semiconductor devices. Mechanical and climatic test methods Part 24. Accelerated moisture resistance. Unbiased HAST
BS EN IEC 60749-24 Semiconductor devices. Mechanical and climatic test methods Part 24. Accelerated moisture resistance. Unbiased HAST
Vydáno: 2024-09-06
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24/30497542 DC
BS EN IEC 60749-21 Semiconductor devices. Mechanical and climatic test methods Part 21. Solderability
BS EN IEC 60749-21 Semiconductor devices. Mechanical and climatic test methods Part 21. Solderability
Vydáno: 2024-09-06
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24/30502907 DC
BS EN IEC 60749-22-2 Semiconductor devices - Mechanical and climatic test methods Part 22-2: Bond strength - Wire bond shear test methods
BS EN IEC 60749-22-2 Semiconductor devices - Mechanical and climatic test methods Part 22-2: Bond strength - Wire bond shear test methods
Vydáno: 2024-12-13
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BS EN 60749-7:2011
Semiconductor devices. Mechanical and climatic test methods Internal moisture content measurement and the analysis of other residual gases
Semiconductor devices. Mechanical and climatic test methods Internal moisture content measurement and the analysis of other residual gases
Vydáno: 2011-09-30
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