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BS EN 60191-6-16:2007
Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Vydáno: 2007-07-31
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BS EN 60749-11:2002
Semiconductor devices. Mechanical and climatic test methods Rapid change of temperature. Two-fluid-bath method
Semiconductor devices. Mechanical and climatic test methods Rapid change of temperature. Two-fluid-bath method
Vydáno: 2003-10-24
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PD IEC/TR 63133:2017
Semiconductor devices. Scan based ageing level estimation for semiconductor devices
Semiconductor devices. Scan based ageing level estimation for semiconductor devices
Vydáno: 2018-01-29
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BS EN 60749-24:2004
Semiconductor devices. Mechanical and climatic test methods Accelerated moisture resistance. Unbiased HAST
Semiconductor devices. Mechanical and climatic test methods Accelerated moisture resistance. Unbiased HAST
Vydáno: 2004-06-24
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BS EN IEC 60747-5-5:2020
Semiconductor devices Optoelectronic devices. Photocouplers
Semiconductor devices Optoelectronic devices. Photocouplers
Vydáno: 2020-09-17
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PD ES 59008-6-2:2001
Data requirements for semiconductor die. Exchange data formats and data dictionary Data dictionary
Data requirements for semiconductor die. Exchange data formats and data dictionary Data dictionary
Vydáno: 2001-06-15
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BS IEC 63229:2021
Semiconductor devices. Classification of defects in gallium nitride epitaxial film on silicon carbide substrate
Semiconductor devices. Classification of defects in gallium nitride epitaxial film on silicon carbide substrate
Vydáno: 2023-08-31
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BS EN IEC 60749-10:2022
Semiconductor devices. Mechanical and climatic test methods Mechanical shock. device and subassembly
Semiconductor devices. Mechanical and climatic test methods Mechanical shock. device and subassembly
Vydáno: 2022-08-16
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24/30502907 DC
BS EN IEC 60749-22-2 Semiconductor devices - Mechanical and climatic test methods Part 22-2: Bond strength - Wire bond shear test methods
BS EN IEC 60749-22-2 Semiconductor devices - Mechanical and climatic test methods Part 22-2: Bond strength - Wire bond shear test methods
Vydáno: 2024-12-13
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