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BS IEC 62047-33:2019
Semiconductor devices. Micro-electromechanical devices MEMS piezoresistive pressure-sensitive device
Semiconductor devices. Micro-electromechanical devices MEMS piezoresistive pressure-sensitive device
Vydáno: 2019-04-18
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BS EN 62047-4:2010
Semiconductor devices. Micro-electromechanical devices Generic specification for MEMS
Semiconductor devices. Micro-electromechanical devices Generic specification for MEMS
Vydáno: 2010-11-30
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BS EN 62047-8:2011
Semiconductor devices. Micro-electromechanical devices Strip bending test method for tensile property measurement of thin films
Semiconductor devices. Micro-electromechanical devices Strip bending test method for tensile property measurement of thin films
Vydáno: 2011-06-30
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BS EN 61223-3-1:1999
Evaluation and routine testing in medical imaging departments Acceptance tests
Evaluation and routine testing in medical imaging departments Acceptance tests
Vydáno: 1999-08-15
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BS IEC 62047-38:2021
Semiconductor devices. Micro-electromechanical devices Test method for adhesion strength of metal powder paste in MEMS interconnection
Semiconductor devices. Micro-electromechanical devices Test method for adhesion strength of metal powder paste in MEMS interconnection
Vydáno: 2021-07-07
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22/30430766 DC
BS EN 60947-10. Low-voltage switchgear and controlgear Part 10. Semiconductor Circuit-Breakers
BS EN 60947-10. Low-voltage switchgear and controlgear Part 10. Semiconductor Circuit-Breakers
Vydáno: 2022-05-05
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BS IEC 62830-7:2021
Semiconductor devices. Semiconductor devices for energy harvesting and generation Linear sliding mode triboelectric energy harvesting
Semiconductor devices. Semiconductor devices for energy harvesting and generation Linear sliding mode triboelectric energy harvesting
Vydáno: 2023-07-07
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24/30499009 DC
BS IEC 63581-1 Semiconductor devices - The recognition criteria of defects in polished indium phosphide wafers Part 1: Classification of defects
BS IEC 63581-1 Semiconductor devices - The recognition criteria of defects in polished indium phosphide wafers Part 1: Classification of defects
Vydáno: 2024-08-16
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