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>BSI Standards>31 ELEKTRONIKA>31.180 Plošné spoje a desky s plošnými spoji

31.180 Plošné spoje a desky s plošnými spoji

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256 results
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BS EN IEC 61188-6-1:2021
Circuit boards and circuit board assemblies. Design and use Land pattern design. Generic requirements for land pattern on circuit boards
Vydáno: 2021-04-07
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BS EN 61193-1:2002
Quality assessment systems Registration and analysis of defects on printed board assemblies
Vydáno: 2002-05-14
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BS EN 61249-2-37:2009
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Vydáno: 2009-04-30
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BS EN 61076-4-114:2003
Connectors for electronic equipment. Printed board connectors with assessed quality Detail specification for two-part connector with integrated shielding function having a grid of 1 mm x 1,5 mm
Vydáno: 2003-06-23
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BS 123300-003:2001
System of quality assessment. Capability detail specification. Rigid multilayer printed boards
Vydáno: 2001-12-17
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BS EN 62496-1:2009
Optical circuit boards General
Vydáno: 2009-07-31
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BS EN 62496-3-1:2010
Optical circuit boards. Performance standard Flexible optical circuit boards using unconnectorized optical glass fibres
Vydáno: 2010-06-30
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BS EN 61249-8-7:1997
Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Marking legend inks
Vydáno: 1997-03-15
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BS EN IEC 61188-6-4:2019
Printed boards and printed board assemblies. Design and use Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
Vydáno: 2019-07-12
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BS EN IEC 61189-5-503:2017
Test methods for electrical materials, printed board and other interconnection structures and assemblies General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards
Vydáno: 2018-04-13
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BS 4584-103.2:1990
Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for copper foil for use in the manufacture of copper-clad base materials
Vydáno: 1990-02-28
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BS EN 61188-1-1:1997
Printed boards and assemblies. Design and use. Generic requirements Flatness considerations for electronic assemblies
Vydáno: 1997-12-15
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256 results
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