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BS EN 60194:2006
Printed board design, manufacture and assembly. Terms and definitions
Printed board design, manufacture and assembly. Terms and definitions
Vydáno: 2006-09-29
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BS EN 62137-1-2:2007
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Shear strength test
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Shear strength test
Vydáno: 2007-10-31
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BS EN 62137-1-5:2009
Surface mounting technology. Environmental and endurance test methods for surface mount solder joints Mechanical shear fatigue test
Surface mounting technology. Environmental and endurance test methods for surface mount solder joints Mechanical shear fatigue test
Vydáno: 2009-07-31
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BS EN 61869-3:2011
Instrument transformers Additional requirements for inductive voltage transformers
Instrument transformers Additional requirements for inductive voltage transformers
Vydáno: 2012-03-31
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BS EN IEC 62878-2-603:2025
Device embedding assembly technology Guideline for stacked electronic module. Test method of intra-module electrical connectivity
Device embedding assembly technology Guideline for stacked electronic module. Test method of intra-module electrical connectivity
Vydáno: 2025-04-16
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BS EN 61193-3:2013
Quality assessment systems Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
Quality assessment systems Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
Vydáno: 2013-06-30
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BS EN 62137-1-1:2007
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Pull strength test
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Pull strength test
Vydáno: 2007-10-31
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BS EN 61193-2:2007
Quality assessment systems Selection and use of sampling plans for inspection of electronic components and packages
Quality assessment systems Selection and use of sampling plans for inspection of electronic components and packages
Vydáno: 2007-12-31
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