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313.49 €
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PD IEC TR 62878-2-7:2019
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
Vydáno: 2019-04-01
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BS EN 61191-2:2017
Printed board assemblies Sectional specification. Requirements for surface mount soldered assemblies
Printed board assemblies Sectional specification. Requirements for surface mount soldered assemblies
Vydáno: 2019-10-07
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BS EN IEC 61760-3:2021
Surface mounting technology Standard method for the specification of components for through-hole reflow (THR) soldering
Surface mounting technology Standard method for the specification of components for through-hole reflow (THR) soldering
Vydáno: 2021-03-18
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PD IEC PAS 61191-10:2022
Printed board assemblies Application and utilization of protective coatings for electronic assemblies
Printed board assemblies Application and utilization of protective coatings for electronic assemblies
Vydáno: 2022-09-13
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BS EN 60194:2006
Printed board design, manufacture and assembly. Terms and definitions
Printed board design, manufacture and assembly. Terms and definitions
Vydáno: 2006-09-29
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BS EN 62137-1-2:2007
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Shear strength test
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Shear strength test
Vydáno: 2007-10-31
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