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BS EN 60194:2006
Printed board design, manufacture and assembly. Terms and definitions
Printed board design, manufacture and assembly. Terms and definitions
Vydáno: 2006-09-29
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BS EN 61869-3:2011
Instrument transformers Additional requirements for inductive voltage transformers
Instrument transformers Additional requirements for inductive voltage transformers
Vydáno: 2012-03-31
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508.05 €
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BS EN 62137-1-2:2007
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Shear strength test
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Shear strength test
Vydáno: 2007-10-31
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BS EN 62137-1-5:2009
Surface mounting technology. Environmental and endurance test methods for surface mount solder joints Mechanical shear fatigue test
Surface mounting technology. Environmental and endurance test methods for surface mount solder joints Mechanical shear fatigue test
Vydáno: 2009-07-31
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BS EN IEC 62878-2-603:2025
Device embedding assembly technology Guideline for stacked electronic module. Test method of intra-module electrical connectivity
Device embedding assembly technology Guideline for stacked electronic module. Test method of intra-module electrical connectivity
Vydáno: 2025-04-16
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BS EN 61188-5-6:2003
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides
Vydáno: 2003-06-26
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PD IEC TR 61191-8:2021
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Vydáno: 2021-03-25
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PD IEC TR 62878-2-8:2021
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Vydáno: 2021-07-29
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