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PD IEC TR 60068-3-12:2022
Environmental testing Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile
Environmental testing Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile
Vydáno: 2022-11-30
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PD IEC TR 61760-5-1:2024
Surface mounting technology Surface strain on circuit board. Strain gauge measurement applied to chip components
Surface mounting technology Surface strain on circuit board. Strain gauge measurement applied to chip components
Vydáno: 2024-02-07
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24/30498340 DC
BS EN IEC 61869-3 Instrument transformers Additional requirements for inductive voltage transformers
BS EN IEC 61869-3 Instrument transformers Additional requirements for inductive voltage transformers
Vydáno: 2024-08-02
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BS EN IEC 60068-2-88:2025
Environmental testing Tests. Test XD: Resistance of components and assemblies to liquid cleaning media
Environmental testing Tests. Test XD: Resistance of components and assemblies to liquid cleaning media
Vydáno: 2025-08-12
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BS EN 62137-1-3:2009
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic drop test
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic drop test
Vydáno: 2009-03-31
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BS EN 61188-1-1:1997
Printed boards and assemblies. Design and use. Generic requirements Flatness considerations for electronic assemblies
Printed boards and assemblies. Design and use. Generic requirements Flatness considerations for electronic assemblies
Vydáno: 1997-12-15
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BS EN 61193-1:2002
Quality assessment systems Registration and analysis of defects on printed board assemblies
Quality assessment systems Registration and analysis of defects on printed board assemblies
Vydáno: 2002-05-14
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BS EN IEC 62878-2-5:2019
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
Vydáno: 2019-11-18
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