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Main page>BSI Standards>31 ELEKTRONIKA>31.190 Sestavy elektronických součástek

31.190 Sestavy elektronických součástek

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88 results
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PD IEC TR 60068-3-15:2024
Environmental testing Supporting documentation and guidance. Vacuum-assisted reflow soldering
Vydáno: 2024-04-08
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PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Vydáno: 2022-08-23
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22/30383603 DC
BS IEC 63215-4. Endurance test methods for die attach materials applied to power electronic devices Part 4. Power cycling test method for die attach materials (near chip interconnection) applied to module type power electronic devices
Vydáno: 2022-12-15
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PD IEC TR 60068-3-12:2022 - TC
Tracked Changes. Environmental testing Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile
Vydáno: 2022-12-20
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PD IEC TR 61191-9:2023
Printed board assemblies Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications. Best practices
Vydáno: 2023-06-19
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25/30511572 DC
Draft BS EN 63609-2 Measurement method used in thermal design for electronics assemblies Part 2: Measurement method for thermal conductivity of circuit boards with polymer composites
Vydáno: 2025-11-11
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PD IEC TR 62878-2-7:2019
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
Vydáno: 2019-04-01
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BS EN IEC 61190-1-3:2018 - TC
Tracked Changes. Attachment materials for electronic assembly Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Vydáno: 2020-02-27
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BS EN IEC 61760-3:2021
Surface mounting technology Standard method for the specification of components for through-hole reflow (THR) soldering
Vydáno: 2021-03-18
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BS EN 61191-2:2017
Printed board assemblies Sectional specification. Requirements for surface mount soldered assemblies
Vydáno: 2019-10-07
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BS EN IEC 61188-6-2:2021
Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for the most common surface mounted components (SMD)
Vydáno: 2021-03-19
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BS EN IEC 61191-1:2018
Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Vydáno: 2018-11-13
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88 results
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