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>BSI Standards>31 ELEKTRONIKA>31.190 Sestavy elektronických součástek

31.190 Sestavy elektronických součástek

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87 results
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BS EN 61193-3:2013
Quality assessment systems Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
Vydáno: 2013-06-30
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BS EN 61190-1-2:2014
Attachment materials for electronic assembly Requirements for soldering pastes for high-quality interconnects in electronics assembly
Vydáno: 2014-06-30
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BS EN 60068-2-58:2015+A1:2018
Environmental testing Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Vydáno: 2018-05-21
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PD IEC TR 61191-8:2021
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Vydáno: 2021-03-25
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PD IEC TR 62878-2-8:2021
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Vydáno: 2021-07-29
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BS EN 62090:2017
Product package labels for electronic components using bar code and two- dimensional symbologies
Vydáno: 2017-07-31
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BS EN IEC 62435-9:2021
Electronic components. Long-term storage of electronic semiconductor devices Special cases
Vydáno: 2021-10-11
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BS EN 60068-2-69:2017+A1:2019
Environmental testing Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
Vydáno: 2019-09-11
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PD IEC TR 61191-7:2020
Printed board assemblies Technical cleanliness of components and printed board assemblies
Vydáno: 2020-03-23
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21/30439434 DC
BS EN IEC 63215-5. Endurance test methods for die attach materials Part 5. Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices
Vydáno: 2021-12-03
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PD IEC TR 61188-8:2021
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library
Vydáno: 2021-01-22
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22/30383603 DC
BS IEC 63215-4. Endurance test methods for die attach materials applied to power electronic devices Part 4. Power cycling test method for die attach materials (near chip interconnection) applied to module type power electronic devices
Vydáno: 2022-12-15
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87 results
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