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BS EN 62137-3:2012
Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints
Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints
Vydáno: 2012-03-31
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BS EN 62137-4:2014
Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
Vydáno: 2015-06-30
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BS EN 61189-1:1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods and methodology
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods and methodology
Vydáno: 2002-06-21
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BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Vydáno: 2021-08-20
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BS EN 61188-5-2:2003
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components
Vydáno: 2003-10-16
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BS EN 62421:2007
Electronics assembly technology. Electronic modules
Electronics assembly technology. Electronic modules
Vydáno: 2007-12-31
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DD IEC/PAS 62588:2008
Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes
Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes
Vydáno: 2008-10-31
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BS EN 62739-3:2017
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Selection guidance of erosion test methods
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Selection guidance of erosion test methods
Vydáno: 2017-04-30
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