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31.190 Sestavy elektronických součástek
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BS EN 61193-1:2002
Quality assessment systems Registration and analysis of defects on printed board assemblies
Quality assessment systems Registration and analysis of defects on printed board assemblies
Vydáno: 2002-05-14
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BS EN 62137-1-3:2009
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic drop test
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic drop test
Vydáno: 2009-03-31
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BS EN 62137-1-4:2009
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic bending test
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic bending test
Vydáno: 2009-03-31
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BS EN IEC 62878-2-5:2019
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
Vydáno: 2019-11-18
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BS EN 61760-4:2015+A1:2018
Surface mounting technology Classification, packaging, labelling and handling of moisture sensitive devices
Surface mounting technology Classification, packaging, labelling and handling of moisture sensitive devices
Vydáno: 2020-06-16
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BS EN IEC 60068-2-82:2019 - TC
Tracked Changes. Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies
Tracked Changes. Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies
Vydáno: 2020-02-24
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BS EN IEC 60068-2-82:2019
Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies
Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies
Vydáno: 2019-07-12
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BS EN 61190-1-1:2002
Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly
Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly
Vydáno: 2002-08-16
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BS EN IEC 61188-6-1:2021
Circuit boards and circuit board assemblies. Design and use Land pattern design. Generic requirements for land pattern on circuit boards
Circuit boards and circuit board assemblies. Design and use Land pattern design. Generic requirements for land pattern on circuit boards
Vydáno: 2021-04-07
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BS EN IEC 60068-2-21:2021
Environmental testing Tests. Test U: Robustness of terminations and integral mounting devices
Environmental testing Tests. Test U: Robustness of terminations and integral mounting devices
Vydáno: 2021-09-13
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