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31.190 Sestavy elektronických součástek
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BS EN 62090:2017
Product package labels for electronic components using bar code and two- dimensional symbologies
Product package labels for electronic components using bar code and two- dimensional symbologies
Vydáno: 2017-07-31
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BS EN 61193-2:2007
Quality assessment systems Selection and use of sampling plans for inspection of electronic components and packages
Quality assessment systems Selection and use of sampling plans for inspection of electronic components and packages
Vydáno: 2007-12-31
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BS EN 62137-1-1:2007
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Pull strength test
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Pull strength test
Vydáno: 2007-10-31
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PD IEC TR 61191-8:2021
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Vydáno: 2021-03-25
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PD IEC TR 62878-2-8:2021
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Vydáno: 2021-07-29
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PD IEC TR 60068-3-15:2024
Environmental testing Supporting documentation and guidance. Vacuum-assisted reflow soldering
Environmental testing Supporting documentation and guidance. Vacuum-assisted reflow soldering
Vydáno: 2024-04-08
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PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Vydáno: 2022-08-23
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24/30502381 DC
BS EN IEC 61760-4 Surface mounting technology Part 4: Classification, packaging, labelling and handling of moisture sensitive devices ED2
BS EN IEC 61760-4 Surface mounting technology Part 4: Classification, packaging, labelling and handling of moisture sensitive devices ED2
Vydáno: 2024-10-18
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