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PD IEC TR 61188-8:2021
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library
Vydáno: 2021-01-22
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BS EN IEC 62435-9:2021
Electronic components. Long-term storage of electronic semiconductor devices Special cases
Electronic components. Long-term storage of electronic semiconductor devices Special cases
Vydáno: 2021-10-11
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PD IEC TR 60068-3-15:2024
Environmental testing Supporting documentation and guidance. Vacuum-assisted reflow soldering
Environmental testing Supporting documentation and guidance. Vacuum-assisted reflow soldering
Vydáno: 2024-04-08
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24/30502381 DC
BS EN IEC 61760-4 Surface mounting technology Part 4: Classification, packaging, labelling and handling of moisture sensitive devices ED2
BS EN IEC 61760-4 Surface mounting technology Part 4: Classification, packaging, labelling and handling of moisture sensitive devices ED2
Vydáno: 2024-10-18
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PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Vydáno: 2022-08-23
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PD IEC/TS 62878-2-1:2015
Device embedded substrate Guidelines. General description of technology
Device embedded substrate Guidelines. General description of technology
Vydáno: 2015-04-30
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BS EN 62417:2010
Semiconductor devices. Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
Semiconductor devices. Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
Vydáno: 2010-06-30
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