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>BSI Standards>31 ELEKTRONIKA>31.190 Sestavy elektronických součástek

31.190 Sestavy elektronických součástek

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86 results
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BS EN 60068-2-69:2017+A1:2019
Environmental testing Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
Vydáno: 2019-09-11
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PD IEC TR 61191-7:2020
Printed board assemblies Technical cleanliness of components and printed board assemblies
Vydáno: 2020-03-23
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21/30439434 DC
BS EN IEC 63215-5. Endurance test methods for die attach materials Part 5. Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices
Vydáno: 2021-12-03
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PD IEC TR 61188-8:2021
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library
Vydáno: 2021-01-22
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BS EN 61190-1-2:2014
Attachment materials for electronic assembly Requirements for soldering pastes for high-quality interconnects in electronics assembly
Vydáno: 2014-06-30
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BS EN 60068-2-58:2015+A1:2018
Environmental testing Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Vydáno: 2018-05-21
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BS EN 60939-2-1:2004
Complete filter units for radio interference suppression Blank detail specification. Passive filter units for electromagnetic interference suppression. Filters for which safety tests are required (Assessment level D/DZ)
Vydáno: 2005-02-09
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BS EN 61193-2:2007
Quality assessment systems Selection and use of sampling plans for inspection of electronic components and packages
Vydáno: 2007-12-31
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BS EN 62137-1-1:2007
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Pull strength test
Vydáno: 2007-10-31
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BS EN 61193-3:2013
Quality assessment systems Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
Vydáno: 2013-06-30
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PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Vydáno: 2022-08-23
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22/30383603 DC
BS IEC 63215-4. Endurance test methods for die attach materials applied to power electronic devices Part 4. Power cycling test method for die attach materials (near chip interconnection) applied to module type power electronic devices
Vydáno: 2022-12-15
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86 results
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