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Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
Published date: 01.09.2013
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5726 Kč
IPC-2581 - Revision B - With Amendment 1
Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
Published date: 01.12.2016
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4130 Kč
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IPC-2581 - Revision C
Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
Published date: 01.11.2020
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4130 Kč
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6196 Kč
IPC-2591 - Version 1.2 - Standard Only
Connected Factory Exchange (CFX)
Connected Factory Exchange (CFX)
Published date: 01.09.2020
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4130 Kč
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IPC-2591 - Version 1.3 - Standard Only
Connected Factory Exchange (CFX)
Connected Factory Exchange (CFX)
Published date: 01.02.2021
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4130 Kč
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6196 Kč
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4130 Kč
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6196 Kč
IPC-4101 - Revision C
Specification for Base Materials for Rigid and Multilayer Printed Boards
Specification for Base Materials for Rigid and Multilayer Printed Boards
Published date: 26.08.2009
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4130 Kč
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6196 Kč
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German Zabezpečené PDF
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9575 Kč
IPC-4101 - Revision E - With Amendment 1
Specification for Base Materials for Rigid and Multilayer Printed Boards
Specification for Base Materials for Rigid and Multilayer Printed Boards
Published date: 01.04.2020
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4130 Kč
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IPC-4130 - Standard Only
Specification & Characterization Methods for Nonwoven "E" Glass Mat
Specification & Characterization Methods for Nonwoven "E" Glass Mat
Published date: 01.09.1998
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2316 Kč
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IPC-4202 - Revision A
Flexible Base Dielectrics for Use in Flexible Printed Circuitry
Flexible Base Dielectrics for Use in Flexible Printed Circuitry
Published date: 13.04.2010
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IPC-4204 - Revision A - With Amendment 1
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
Published date: 22.02.2014
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3359 Kč
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5038 Kč
IPC-4412 - Revision B
Specification for Finished Fabric Woven from "E" Glass for Printed Boards
Specification for Finished Fabric Woven from "E" Glass for Printed Boards
Published date: 17.06.2013
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IPC-4552 - Revision A
Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
Published date: 01.08.2017
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