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sklademVydáno: 2008-01-30
IEC 60749-37:2008
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 37: Méthode d'essai de chute au niveau de la carte avec utilisation d'un accéléromètre
Měna
| Označení normy: | IEC 60749-37:2008 |
| Vydáno: | 2008-01-30 |
| Jazyk: | Anglicky/Francouzsky |
Popis
IEC 60749-37:2008
Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.